We look forward to seeing you at the Hynes Convention Center in Boston! 
IMAPS is hosting the 55th International Symposium on Microelectronics, the main topic: PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL
Stop by our booth-315 to learn about the latest advancements in packaging studies related to Thermal Warpage Measurement, strain, and CTE measurements. The exhibition opens on October 4th from 11:00 – 16:00 and on October 5th from 11:00 – 18:30.
ESREF 2022