Thanks to its innovative technology and unique features, TDM system has been chosen by major companies in the field of electronics and semi-conductors for both quality control and R&D purposes. Our customers acknowledged the technical advantages of the TDM system such as the high resolution sensor, the versatility of the system and its user friendliness.

The TDM is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control.

Warpage capability at a glance

  • -65 to 400°C
  • Top and bottom heating
  • Heating ramp up to +6°C/s
  • Z resolution < 1µm
  • Ultra high camera resolution
  • Measurement of discontinuities
  • Full field acquisition in 2 s
  • Samples up to 400mm x 500mm
  • Automatic post processing
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