TDM by Insidix offers state of the art deformation or warpage measurement system while devices under evaluation are experiencing thermal stress. The technology uses phase shifting Projection Moiré, advanced 3D sensors, and temperature chambers that can withstand temperatures between -65°C to 400°C.
The systems are ideal for research development, quality and reliability, process development, and failure analysis studies. Present in semiconductor, medical, automotive, aerospace, and electronics industries.

Warpage Measurement TDM Systems

Warpage capability at a glance

Why TDM ?

We meet and surpass all deformation measurement standards for temperature cycling, moisture/reflow, coplanarity testing, warpage test methods, among others.
Our advancements in 3D analysis and Projection Moiré have evolved into nanoscale detectability.

Let us show you the unique capability and functionality of the TDM system. Request a free sample analysis today!