TDM Compact

TDM Compact : Full modularity and flexibility

Warpage measurement on µm scale from -60°C to 300°C
Independently controlled top/bottom heater banks
Fast heating and cooling ramp
Ultra high resolution camera for fine feature analysis
Sample drawer for easy sample loading

The TDM Compact is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control. TDM-Compact acquires a full, absolute 3D cartography of devices with dimensions up to 310 mm x 230 mm (field of view up to 150 mm x 150 mm). Simultaneously, its powerful heating and cooling capabilities allow for virtually any temperature profile on the sample under test.

Features

Imaging
Direct sample illumination, non-contact measurement
Maximum sample size
310 mm x 230 mm
Field of view (x, y)
Continuous zoom from 30 x 30 to 150 x 150 mm
Depth of view (z)
Up to 25 mm
CCD camera resolution
5 megapixel
Accuracy
+/-1.5 micron or 3% of measured value, whichever is greater
Heating rate
up to +2°C/s
Cooling rate
Up to -2°/s
Footprint
140cm x 120cm x 245cm
Request datasheet

TDM Large Scale

TDM LS : Large size and large sample capability

Warpage measurement on µm scale of object up to 400x400 mm
Independently controlled top/bottom heater banks
Fast heating and cooling ramp
Ultra high resolution camera for fine feature analysis
Sample drawer for easy sample loading

The TDM Large Scale complements the TDM Compact. The first generation of TDM was designed for surface analysis of relatively small area (up to 150x150 mm) while the TDM Large Scale offers surface inspection of areas up to 400x400 mm. Therefore the thermo-mechanical analysis of boards, wafers, and other large object becomes possible.

Features

Imaging
Direct sample illumination, non contact measurement
Maximum sample size
600 mm x 430 mm
Field of view (x, y)
Adjustable Zoom from 30 x 30 to 400 x 400 mm
Depth of view (z)
Up to 25 mm
CCD camera resolution
5 megapixel
Accuracy
+/-1.5 micron or 3% of measured value, whichever is greater
Heating rate
up to +3°C/s
Cooling rate
Up to -3°/s
Footprint
200 cm x 150 cm x 250 cm
Request datasheet

TDM Table Top

TDM Table Top : Self-contained, fluid-free and easily fits on a bench-top

Warpage measurement on µm scale from room temperature to 300°C
Independently controlled top/bottom heater banks
Fast heating and cooling ramp
Ultra high resolution camera for fine feature analysis
Sample drawer for easy sample loading

The TDM Table top is an affordable solution for lab environment. It is compact, self-contained, fluid-free and easily fits on a bench-top. TDM TT does not require compressed air or exhaust.

Features

Imaging
Direct sample illumination, non-contact measurement
Maximum sample size
120 mm x 120 mm
Field of view (x, y)
75 mm x 75 mm
Depth of view (z)
20 mm
CCD camera resolution
5 megapixel
Accuracy
+/-1.5 micron or 3% of measured value, whichever is greater
Heating rate
up to +2°C/s
Cooling rate
Up to -2°/s
Footprint
120cm x 80cm x 90 cm
Request datasheet

Software

TDM Control
To adjust and set up the 3D measurements and thermal conditions
TDM Batch
To calculate the warpage variations of samples during a batch measurement and to automatically generate a report (pdf, excel, ect)
TDM Warpage
3D software for advanced application (more than 135 advanced features)
TDM Strain
To evaluate the strain and CTE variation of samples during a thermal cycle

Options

Sub-zero capability
TDM compact only
A controlled flow of nitrogen is blown into the chamber to adjust the temperature of the samples from -60°C to 300°C
EXTRA SMALL FOV
TDM compact only
The extra small FOV consist in a additional set of optics to obtain a FOV at 10 x 10 mm
CTE quantification
TDM compact and TDM LS
In-plane deformation analysis (Δx, Δy)(x, y)
Software design
TDM compact and TDM LS
Our software and application engineers can develop and implement special post-processing treatment on demand.

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