Thanks to its innovative technology and unique features, TDM system has been chosen by major companies in the field of electronics and semi-conductors for both quality control and R&D purposes. Our customers acknowledged the technical advantages of the TDM system such as the high resolution sensor, the versatility of the system and its user friendliness.

The TDM is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control.

WARPAGE MEASUREMENT ON µM SCALE from -60°C to 300°C

  • Process qualification
  • Quality control
  • Evaluation on components and assemblies
  • R&D application
  • CTE characterization
  • FAILURE UNDERSTANDING AND ANTICIPATION

  • PCB Deformation during soldering
  • BGA balls breakage at interfaces
  • Complex packaging understanding
  • Delamination
  • Consequences of new molding compound
  • NEW NEED FOR WARPAGE MEASUREMENT

  • Lead-free solder
  • Higher density and smaller balls
  • Thinner components and PCB
  • Larger BGA-type devices
  • Higher heating dissipation
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